CONNECTING MEMBER, CONNECTING STRUCTURE OF ELECTRODES CONNECTED WITH THE SAME, AND CONNECTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a connecting member which is excellent in the reliability for long time connection and also is excellent in workability because of no need to position accurately electroconductive particles to an electrode, and a connecting structure of electrodes using the same. SOLUTION: The connecting member for a semiconductor chip is a multi-layered connecting member which has an insulating adhesive layer formed on at least one surface of an adhesive layer made of an electroconductive material and a binder to have electroconductivity along the pressurizing direction, wherein the binder component has melt viscosity of 500 poise or less at the connection that is not more than that the insulating adhesive layer has; and the binder and the insulating adhesive layer contain their main components of a high molecular weight of epoxy resin or an epoxy resin modified with a styrene-ethylene-butylene-styrene blocked copolymer. COPYRIGHT: (C)2008,JPO&INPIT