发明名称 Au/Ge ALLOY SOLDER BALL
摘要 PROBLEM TO BE SOLVED: To provide an Au/Ge alloy solder ball having excellent oxidation resistance and satisfactory wettability compared with the conventional one. SOLUTION: The whole other than a surface layer is composed of an alloy having an Au-Ge eutectic composition or an alloy having a composition near the eutectic composition, and the surface layer is composed of an Au solid solution in which Au and Ge are solid-soluted. The maximum height Ry of the surface roughness is≤0.5μm. Regarding its production, a sphere made of an alloy having an Au-Ge eutectic composition or an alloy having a composition near the eutectic composition is charged to a vessel together with pure water admixed with a surfactant, and vibration is applied thereto, thus the Ge content is reduced from the surface layer, so as to modify the surface layer, and thereafter, cleaning is performed, so as to remove the surfactant from the surface. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008030093(A) 申请公布日期 2008.02.14
申请号 JP20060206258 申请日期 2006.07.28
申请人 SUMITOMO METAL MINING CO LTD 发明人 YAMAGUCHI KOICHI;MINAMI HIRONAO
分类号 B23K35/30;B23K35/40;C22C5/02 主分类号 B23K35/30
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