A METHOD FOR ADJUSTING SUBSTRATE PROCESSING TIMES IN A SUBSTRATE POLISHING SYSTEM
摘要
<p>Aspects of the present invention include a method and an apparatus that may be utilized to adjust processing times in a substrate processing system. In one embodiment of the present invention, a pre-processing thickness measurement of a substrate while the substrate is in one of the polishing stations is taken. Then the substrate is processed in the polishing system for a predetermined processing time. A post-processing thickness measurement is taken while the substrate is in one of the polishing stations. A removal rate is calculated based on the pre-processing and the post-processing measurements and the predetermined processing time. A processing time is adjusted for one or more of the polishing stations based on the removal rate for use in subsequent processing of a production substrate.</p>
申请公布号
WO2007114964(A3)
申请公布日期
2008.02.14
申请号
WO2007US60107
申请日期
2007.01.04
申请人
APPLIED MATERIALS, INC.;KO, SEN-HOU;LEE, HARRY Q.;HSU, WEI-YUNG