| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a board unit by which a height of a frame can be reduced. <P>SOLUTION: Parts 23 are put on a front surface of a substrate 22. A plate member 34 for suction is attached to a frame 25. The frame 25 maintained at an end of a suction nozzle 36 is put on the front surface of the substrate 22. A heat is applied to the substrate 22 after uncoupling the suction nozzle 36. The parts 23 and the frame 25 are soldered to the substrate 22. According to this manufacturing method, the plate member 34 for suction is attached to the frame 25 so as to be freely attached and detached. After soldering the parts 23 and the frame 25, the plate member 34 for suction can be removed from the frame 25. For example, if a predetermined clearance is ensured between the plate member 34 for suction and the parts 23, a height of the frame 25 can be freely set according to the plate member 34 for suction. The height of the frame 25 can be less than heights of the parts 23 and the clearance. The height of the frame 25 is reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
