| 摘要 |
A probe card for testing a flip chip device is provided. In one embodiment, the probe card comprises a printed circuit board having a first surface and a second surface, the first surface configured to face the flip chip device; a frame for securing the printed circuit board in place; a plurality of probe pins extending from the first surface in a manner which causes free ends of the pins to contact a plurality of bumps on the flip chip device; and a support member attached substantially flush with the frame above the second surface of the printed circuit board.
|
