Lightweight, Hermetically Sealed Package Having Auxiliary, Selectively Contoured, Low Mass, Pseudo Wall Insert For Surface-Mounting And Dissipating Heat From Electronic Circuit Components

摘要

A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.