The assembly of a packaged opto-electronic module of a type that comprises an optical subassembly coupled to an LC housing integrally formed within the housing of the module typically results in the optical subassembly being disposed in a location having a gap between a heat sink region of the module and the optical subassembly thereby causing the disadvantage of inefficient heat removal from the optical subassembly. The present invention obviates or at least mitigates the above disadvantage by freeing the LC connector housing (200) from the housing (400) of the module thus enabling the optical subassenbly (100) to be disposed in thermal contact with the heat sink region (306,422) of the module. <IMAGE>
