| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a new electroplating method suitable for filling a non-penetrating hole with a metal. <P>SOLUTION: Regarding the electroplating method where a blind via hole is filled with a metal, in the electroplating method using a plating liquid comprising additives such as a surfactant, a brightener and a smoother, the method includes: a pulse plating stage where the adsorption and leaving of the additives on the surface of the member to be plated and in the non-penetrating hole are controlled; and the subsequent direct current plating stage where the inside of the non-penetrating hole is filled with a metal. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
