METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS

摘要

Provided is a method for manufacturing an electroformed mold. This manufacturing method forms a first photoresist layer (3) on the upper face of a bottom conductive film (2) of a substrate (1), and divides the first photoresist layer (3) into a soluble portion (3b) and an insoluble portion (3a). Next, a conductive material is heated and deposited within such a temperature range on the upper face of the first photoresist layer as emits a light of a wavelength to make the first photoresist layer insensitive, thereby to form an intermediate conductive film (5). After this intermediate conductive film was patterned, a second photoresist layer (6) is formed on the upper face of the first photoresist layer exposed by removing the intermediate conductive film and on the upper face of the intermediate conductive film left by the patterning. The second photoresist layer is divided into a soluble portion (6b) and an insoluble portion (6a). Then, the first photoresist layer and the second photoresist layer are developed to remove the soluble portions (3b, 6b), thereby to manufacture an electroformed mold (101) having the conductive film on the bottom of each step.