| 摘要 |
A one chip-type RF integrated module is provided to minimize the installation area of an RF block on a substrate and secure flexibility in designing the arrangement of other modules by integrating the circuit elements of the RF block into a single package element and efficiently arranging bonding pads and via holes. A one chip-type RF integrated module(100) is comprised of a front-end module(110), a power amplifier module(130), a transceiver module(140), and a matching circuit module(120). The front-end module(110), the power amplifier module(130), the transceiver module(140), and the matching circuit module(120) form a single package on a substrate. The signal input/output pads of the power amplifier module(130) are formed at an end portion of the substrate. In case more than two via holes are formed on one of the signal input/output pads, such as a "V_Batt" pad, the via holes are formed so as not to be parallel with the side of the end portion.
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