| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which can improve strength, simplify a manufacturing method and manufacture a wiring board excellent in heat radiation performance, even if the wiring board is connected via through holes. SOLUTION: An insulating substrate 3 is compression-molded using a predetermined molding material 1, a copper foil layer is laminated on at least a front surface of both surfaces of the compression-molded insulating substrate 3, and the copper foil layer is etched to form a pattern layer. The molding material 1 is prepared using at least a powdery thermoplastic resin and much low dielectric filler. By selecting materials of the powdered thermoplastic resin and the low dielectric filler, the strength of the low dielectric wiring board can be improved, and damage in usage can be effectively prevented. Further, since the thermoplastic resin softened when heated and exhibiting plasticity is used, productivity and handleability can be improved. COPYRIGHT: (C)2008,JPO&INPIT
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