METHOD OF FORMING FINE VIA HOLE, AND MULTILAYER PRINTED CIRCUIT BOARD USING THE METHOD

摘要

PROBLEM TO BE SOLVED: To efficiently fill a fine via hole with a conductive liquid thermosetting substance using a (nano) inkjet injection system. SOLUTION: A method of forming a via hole that electrically connects wires in respective layers, comprising a first process for machining a via hole in a material in which a hole is machined; a second process for filling the via hole with an ink including a conductive liquid thermosetting substance, by employing an inkjet injection system; and a third process for making the conductive thermosetting substance to remain selectively in the via hole by heating the ink filled in the via hole, where the operations in the second process and third process are carried out repeatedly and make the via hole fill with the conductive thermosetting substance. COPYRIGHT: (C)2008,JPO&INPIT