| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor apparatus and its manufacturing method which can make wiring on a position of a substrate directly under a die pad, hardly cause mold defects such as unfilling and voids of a sealing resin, allow easy processing and molding of leads, and improve the flatness of external terminals. SOLUTION: A holding portion 5 to mount a semiconductor device 10 is installed by upsetting a suspended lead 7 connected to a frame; and an opening portion 6 of a heat dissipating member 2 to promote heat dissipation from the semiconductor device 10 is fit in the suspended lead portion 7 supporting the holding portion 5, whereby the resin-sealed semiconductor apparatus having a built-in heat dissipation plate having a high heat dissipating property is achieved and the substrate wiring can be disposed directly under the resin-sealed semiconductor apparatus when the substrate is mounted. COPYRIGHT: (C)2008,JPO&INPIT
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