| 摘要 |
A land grid array (LGA) connector assembly ( 1 ), comprising: a stiffener ( 2 ) defining locating members ( 4 ) around the respective corners for receiving and holding the electronics package in position; an insulative housing ( 3 ), the housing defining a plurality of contact segments ( 31, 32, 33, 34 ) for engaging respective connection sections of an electronics package; a plurality of electrical contacts received in the contact segments ( 31, 32, 33, 34 ) of the housing ( 3 ); a pick up cap ( 5 ) removably attached to the stiffener ( 2 ), providing a smooth flat top surface ( 501 ) facilitating to be capable of being handled by a device, thereby manipulating the LGA connector assembly ( 1 ) to a desired location on a substrate circuit.
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