发明名称 |
Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and advanced TCA boards |
摘要 |
A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
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申请公布号 |
US2008037218(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
US20070728718 |
申请日期 |
2007.03.26 |
申请人 |
SHARMA VISWA M;CHU WILLIAM;JAMES ALLEN D;TSENG MING S;SCHLEGEL NEIL;LENTZ DAVID;SONNEK CHRISTOPHER D |
发明人 |
SHARMA VISWA M.;CHU WILLIAM;JAMES ALLEN D.;TSENG MING S.;SCHLEGEL NEIL;LENTZ DAVID;SONNEK CHRISTOPHER D. |
分类号 |
H05K7/20;H05K5/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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