发明名称 Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and advanced TCA boards
摘要 A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
申请公布号 US2008037218(A1) 申请公布日期 2008.02.14
申请号 US20070728718 申请日期 2007.03.26
申请人 SHARMA VISWA M;CHU WILLIAM;JAMES ALLEN D;TSENG MING S;SCHLEGEL NEIL;LENTZ DAVID;SONNEK CHRISTOPHER D 发明人 SHARMA VISWA M.;CHU WILLIAM;JAMES ALLEN D.;TSENG MING S.;SCHLEGEL NEIL;LENTZ DAVID;SONNEK CHRISTOPHER D.
分类号 H05K7/20;H05K5/00 主分类号 H05K7/20
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