| 摘要 |
A semiconductor package has a base, a chip attached to the base a flexible connection plate mounted on and electrically connecting the chip and the base, and an encapsulant encapsulating the chip and the flexible connection plate on the base. The flexible connection plate includes a film and a layer of leads integrated with the film. Inner ends of the leads located at a central portion of the flexible connection plate are connected to contact pads of the chip, and outer ends of the leads located at an outer peripheral portion of the flexible connection plate are connected to leads of the base.
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