METHOD AND DEVICE FOR LAYING THIN WIRE

摘要

The invention relates to a method and a device for laying thin wire. During the automatic laying of wire onto a substrate, the wire that is pre-coated with adhesive has to be pressed tightly against the substrate without damaging the wire. This becomes increasingly difficult with decreasing wire diameters (< 0.1 mm). The wire (1) to be laid is pressed onto the substrate surface (4) electrostatically. During this procedure, the wire and an electrode (29) positioned underneath the substrate are connected to an electrical voltage. The electrical attractive force presses the wire against the surface in such a way that the wire can be laid continuously, coming out from the laying head (20), with a predetermined drag. While the attractive force is operational, the substrate surface is heated under the wire in the application segment (33) of the wire in order to melt the adhesive and to stick the wire down. This method is suitable for almost invisible electrical connection lines of microelectronic components on large panes of glass and for laying polymer- and glass fibers onto electronic circuit boards.