发明名称 SUBSTRATE ADSORPTION DEVICE AND SUBSTRATE BONDING DEVICE
摘要 A substrate adsorption device 1 includes: a stage 11 having an adsorption face 12 for holding a substrate 20 ; a plurality of adsorption ports 13 formed in a region of the adsorption face 12 of the stage 11 ; and a vacuum pump 14 connected to each adsorption port through an air discharge path 17 . A pressure sensor 18 for detecting the pressure in the air discharge path 17 is provided, and a plurality of leak trenches 30 open to both the adsorption face 12 of the stage 11 and a side face of the stage 11 are formed in a region of the stage 11 except the region where the adsorption ports 13 are formed. With such a low-cost and simple structure, a foreign matter 15 , which is a factor of inviting damage to the substrate 20 , is detected, to prevent damage to the substrate 20.
申请公布号 KR100803452(B1) 申请公布日期 2008.02.14
申请号 KR20067009750 申请日期 2006.05.19
申请人 发明人
分类号 H01L21/683;G02F1/13;G02F1/1333;H01L21/00;H01L21/68 主分类号 H01L21/683
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