METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT BOARD, AND THREE-DIMENSIONAL CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a three-dimensional circuit board which provides a highly reliable insulation at a processed portion by an irradiation of a high energy beam on an aluminum nitride board with an oxide layer formed, improves a peel strength of the oxide layer, and reduces a processing time; and to provide the three-dimentional circuit board. SOLUTION: The method for manufacturing the three-dimensional circuit board A comprises the steps of an oxide layer forming step (S2) of forming the oxide layer 2 by conducting an oxidation treatment of the surface of the aluninum nitride board 1 before a metalization processing step (S4) of forming a conductive thin film 4, and an impact buffering layer forming step (S3) of forming an metal impact buffering layer 3a can be formed earlier than the oxide layer 2 and buffering the impact given to the aluminium nitride board 1 by the high energy beam irradiated in a laser processing step (S5) on the surface of the oxide layer 2. COPYRIGHT: (C)2008,JPO&INPIT