SUBSTRATE FOR LED AND LED PACKAGE

摘要

Disclosed is an easily manufacturable substrate for LEDs having excellent heat-dissipating properties. Also disclosed is an LED package using such a substrate for LEDs. Specifically disclosed is a substrate (1) for LEDs wherein an insulating layer (11) provided with an LED mounting hole (14) is bonded to a flat surface of a heat-dissipating unit (10) and a wiring unit (12) having a wiring pattern is formed on the insulating layer (11). Also specifically disclosed is an LED package (2) wherein an LED chip (20) is mounted on the heat-dissipating unit (10) in the LED mounting hole (14) of the substrate (1) for LEDs and the LED chip (20) is electrically connected to the wiring unit (12).