CONNECTION METHOD AND CONNECTION STRUCTURE FOR INTER-SUBSTRATE-WIRING PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a connection method and a connection structure for an inter-substrate-wiring pattern that prevent the occurrence of an increase in the number of components or complication of a connection process due to connection while allowing sure electrical connection between wiring patterns of two substrates.

SOLUTION: On a first substrate 11 having a metal film as a conductive part formed on its surface a bump 15 that is raised on the film surface by melting the metal film is formed by irradiating thermal energy generated by a laser beam to the position of the metal film which forms an electrode pattern 12. Subsequently, an electrode pattern 22 of a second substrate 21 is arranged oppositely to the electrode pattern of the first substrate while an antisotropic conductive adhesion film 31 is interposed between them. The electrode pattern of the second substrate is pressed against the bump of the electrode pattern of the first substrate by pressurizing and heating from the rear face of the second substrate in that state. The antisotropic conductive adhesion film is thermally cured in a gap between the first/second substrates so as to connect the electrode pattern of the first substrate with that of the second substrate.

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