| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a connection plate with improved general purpose is provided and a semiconductor element is positively sealed by a sealing resin, and a manufacturing method thereof. <P>SOLUTION: A connection conductive material 16A is placed on an electrode 33A formed on the surface of a semiconductor element 14, and a metal connection plate 15A is joined to the upper surface of the connection conductive material 16A. In other words, the thick connection conductive material 16A is positioned between the semiconductor element 14 and the metal connection plate 15A. This configuration increases the thickness of a gap between the metal connection plate 15A and the semiconductor element 14, and the gap is easily filled with a sealing resin 17 to prevent the generation of a void. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
