| 摘要 |
<P>PROBLEM TO BE SOLVED: To constitute a semiconductor device by installing wiring of low resistance in a wiring board loading semiconductor elements where solder bump electrodes are formed even at narrow wiring pitches. <P>SOLUTION: The semiconductor device is provided with IC chips (semiconductor elements) 2, 3 and 4 where solder bumps (solder bump electrodes) 24 are formed on electrode pads; and the wiring board 1 having connection terminals 7 to which the solder bumps 24 of the IC chips 2, 3 and 4 are connected, outer connection terminals 8 for connection with outer units, solder balls 5 formed on the connection terminals 8, and conductor wirings 9 which are arranged in a groove formed on a board face and connect the connection terminals 7 and the outer connection terminals 8. Since a cross section can be made large by existence of the groove part even if conductor wirings 9 are arranged at the narrow pitch, wiring resistance can be controlled. <P>COPYRIGHT: (C)2008,JPO&INPIT |
