| 摘要 |
Devices for removing heat from electronic components. A device includes a heat sink for attachment to an electronic component and multiple miniature fans. Each miniature fan includes an elongated, generally tubular outer housing member adapted to receive end closure plugs or caps at each end, a miniature electric motor mounted within one of the end caps, and a generally cylindrical shaped rotor/impeller disposed within the tubular housing and extending along the length thereof between the end caps, one end thereof being coupled to the motor. The housing member is provided with openings that extend longitudinally along one side thereof to provide an entrance port, and openings that extend along another side to provide an outlet or exit port. With the exception of the motor, all other parts can be made of an injection molded plastic, metal, or a combination of plastic and metal.
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