CIRCUIT MODULE

摘要

The invention relates to a circuit module (2), comprising at least: a circuit carrier (2), which has at least two layers (3, 3.1, 12), wherein at least one layer (3.1, 12) is formed entirely or partially from a piezoelectric material as a voltage-generating layer (3.1, 12) and has at least two electrodes (16) for tapping a piezo voltage (Up) generated in the voltage-generating layer (12, 3.1) upon mechanical deformation of the circuit carrier (2), and a current supply circuit (36, 37, 41), which receives the piezo voltage (Up) and serves as a voltage source for supplying current to the circuit module.