| 发明名称 |
METHOD AND STRUCTURE FOR CONTROLLED IMPEDANCE WIRE BONDS USING CO-DISPENSING OF DIELECTRIC SPACERS |
| 摘要 |
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. |
| 申请公布号 |
US2008035362(A1) |
申请公布日期 |
2008.02.14 |
| 申请号 |
US20070923413 |
申请日期 |
2007.10.24 |
| 申请人 |
|
发明人 |
KWARK YOUNG H.;SCHUSTER CHRISTIAN |
| 分类号 |
H05K9/00;B23K31/02;H01L23/66;H05K1/02 |
主分类号 |
H05K9/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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