SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME, AND SEALING RESIN

摘要

[PROBLEMS] To provide a flip-chip semiconductor package having high reliability by suppressing generation of cracks and to provide a method for manufacturing such flip-chip semiconductor package. [MEANS FOR SOLVING PROBLEMS] In a flip-chip semiconductor package, a semiconductor chip connecting electrode surface of a circuit board (1) and an electrode surface of a semiconductor chip (2) are flip-chip bonded, a sealing resin (4) is applied between the circuit board (1) and the semiconductor chip (2), and a fillet section (4b) is formed by applying the sealing resin (4) on an outer circumference side portion of the semiconductor chip. The fillet section (4b) has a structure wherein the surface is an inclined surface extending to the external from an upper end (2a) of the outer circumference side portion of the semiconductor chip (2) toward the substrate, and the inclination angle formed by the inclined surface and the outer circumference side portion of the semiconductor chip (2) is 50 degrees or less in the vicinity of an upper end of the outer circumference side portion (2a) of the semiconductor chip.