Stacked module of semiconductor chips has elastic spheres, for movement, compressed between the layers by fasteners in a compact structure

摘要

To produce a module (100) as a stack of overlaid components (101,102), especially semiconductor chips, one or more moving elements (104) are attached to at least one surface to lie between adjacent components. The components are held in position by fasteners (103), which compress the moving elements. The moving elements are elastic spheres.