| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin excellent in photocuring property, and transparency, heat resistance and resistance to heat discoloration of cured products, and a photosensitive resin composition containing the photosensitive resin. <P>SOLUTION: The photosensitive resin is obtained by carrying out addition reaction of a polymer containing hydroxyphenyl (meth)acrylate with glycidyl (meth)acrylate, acrylic acid, etc to introduce an unsaturated double bond. The photosensitive resin composition comprises the photosensitive resin, a photoradical initiator, a radical-polymerizable monomer and/or an organic solvent. <P>COPYRIGHT: (C)2008,JPO&INPIT |
