| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor sealing material which can seal at a low temperature, has a high transmission factor and an excellent weather resistance, and is made up of a non-lead glass being difficult to react with a semiconductor; and to provide a semiconductor element sealed with it. <P>SOLUTION: The semiconductor sealing material is for sealing a semiconductor, the internal transmission factor at a thickness of 1 mm and a wavelength 588 nm is 80% or more, and is made up of an SnO-P<SB>2</SB>O<SB>5</SB>-B<SB>2</SB>O<SB>3</SB>of a softening poit 400°C or lower. The semiconductor element is constructed in such a manner that the semiconductor is sealed with the above sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
