| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wired circuit board excellent in long term reliability in which, while the transmission loss can be reduced by simple lamination, the adhesiveness is improved in a first insulating layer and a metal foil. <P>SOLUTION: A metal supporting board 2 is prepared, a first base insulating layer 3 is formed on the metal supporting board 2, a first metal thin film 4 is formed on the whole surface of the base insulating layer 3, a metal foil 5 is formed on the first metal thin film 4, a second metal thin film 6 is successively formed so as to cover the metal foil 5 and the first metal thin film 4, a second base insulating film 7 is formed on the first base insulating film 3 so as to cover the second metal thin film 6, a third metal thin film 8 is formed on the whole surface of the second base insulating layer 7, a conductor pattern 9 is formed on the third metal thin film 8, a fourth metal thin film 10 is successively formed so as to cover the conductor pattern 9 and the third metal thin film 8, and a cover insulating layer 11 is formed on the second base insulating layer 7 so as to cover the forth metal thin film 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
