| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of uniforming a processing state on the surface of a substrate during vacuum drying processing, and capable of preventing the generation of peeling charge when the substrate is separated from a substrate holding plate. SOLUTION: The substrate processing apparatus 1 has a plurality of discharge holes 21 on the substrate holding plate 20, and holds the substrate 90 on the substrate holding plate 20 in a non-contact state by discharging nitrogen gas from the plurality of discharge holes 21. Consequently, members such as support pins are not abutted on the lower surface of the substrate 90, and the processing state on the surface of the substrate 90 can be uniformed in the vacuum drying processing. Since the substrate processing apparatus 1 holds the substrate 90 on the substrate holding plate 20 in the non-contact state, generation of peeling charge on the surface of the substrate 90 can be prevented when the substrate 90 is separated from the substrate holding plate 20. COPYRIGHT: (C)2008,JPO&INPIT |
