发明名称 METHOD OF FORMING MULTILAYER STRUCTURE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To form a structurally stable multilayer structure using a droplet dispenser. SOLUTION: The method of forming the multilayer structure includes a step of forming a first insulation layer, a conductive layer disposed on the first insulation layer, and a second insulation layer covering the first insulation layer and the conductive layer by heating at a time a first insulation material layer, a second insulation material layer, and a conductive material layer formed using the droplet dispenser. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008034880(A) 申请公布日期 2008.02.14
申请号 JP20070269837 申请日期 2007.10.17
申请人 SEIKO EPSON CORP 发明人 NIIDATE TAKESHI;MIKOSHIBA TOSHIAKI;WADA KENJI;SAKURADA KAZUAKI;YAMADA JUN
分类号 H05K3/10;H05K3/46 主分类号 H05K3/10
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