| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of solving problems of damage to a metal mold when molding is repeated many times, especially, when a metal mold is used such that a metal pile for forming a through-hole or via hole is bent or broken owing to repetition of molding and also making substrates, stacked to manufacture a high-density wiring substrate, thin and decreasing the number of the substrates. SOLUTION: In a wiring structure 60, two conductive layers 62 and 72 which are opposed to each other to constitute wiring, and a base 68 for supporting the two conductive layers, are formed in one body. Such a wiring structure is previously fabricated, and an insulating layer which is united with the wiring structure is formed to obtain a wiring substrate 94 having at least portions of the conductive layers of the wiring structure disposed as wiring in the insulating layer 90. COPYRIGHT: (C)2008,JPO&INPIT |
