发明名称 PROCESS FOR PRODUCTION OF DECORATIVELY PLATED ARTICLE BY UTILIZING THE IMPARTATION OF ELECTROCONDUCTIVITY TO RESIN BY SPUTTERING, AND HANGING JIG FOR FIXING OF RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a process for production of a decoratively plated article where surface roughening of a molded resin article and impartation of electroconductivity to the article are conducted by a dry process without conventional chemicals such as chromic acid, which brings about protection of the article from surface deterioration by chemicals, environmental load reduction due to nonuse of chemicals having large environment load, inhibition of plated resin articles from exfoliation, and secure safety of the articles. SOLUTION: The process comprises the surface cleaning/activation step (S1) of conducting the surface cleaning and surface modification/activation of a molded resin article by plasma treatment, the metal thin film formation step (S2) of forming a metal thin film on the surface of the resulting resin article by metal sputtering, the electroconductive film formation step (S4) of forming an electroconductive film of nickel, copper or the like on the metal thin film by sputtering, and the final electroplating step of electroplating the resulting resin article. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008031555(A) 申请公布日期 2008.02.14
申请号 JP20070175071 申请日期 2007.07.03
申请人 KAKIHARA KOGYO KK 发明人 KAKIHARA KUNIHIRO;NODA YOSHINORI;ORO TAKASHI
分类号 C25D5/56;C23C14/20;C23C14/34;C23C28/02;C25D5/14 主分类号 C25D5/56
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