| 摘要 |
PROBLEM TO BE SOLVED: To provide a coverlay suitable for lamination with a flexible printed wiring board using lead-free solder by solving both problems of dimensional change and heat resistance. SOLUTION: The coverlay is formed by using a polyimide film principally made from a diamine component comprising paraphenylenediamine and 4,4'-diaminodiphenyl ether and an acid dianhydride component comprising pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxilic dianhydride and applying an adhesive to either surface of the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT
|
