发明名称 |
Light emitting device package and method for manufacturing the same |
摘要 |
A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
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申请公布号 |
US2008035942(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
US20070890543 |
申请日期 |
2007.08.07 |
申请人 |
LG ELECTRONICS INC.;LG INNOTEK CO., LTD |
发明人 |
KIM GEUN H.;WON YU HO;PARK CHIL KEUN;SONG KI CHANG |
分类号 |
H01L33/44;H01L33/50;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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