发明名称 Light emitting device package and method for manufacturing the same
摘要 A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
申请公布号 US2008035942(A1) 申请公布日期 2008.02.14
申请号 US20070890543 申请日期 2007.08.07
申请人 LG ELECTRONICS INC.;LG INNOTEK CO., LTD 发明人 KIM GEUN H.;WON YU HO;PARK CHIL KEUN;SONG KI CHANG
分类号 H01L33/44;H01L33/50;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/44
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