| 摘要 |
The present invention provides a package structure with lead-frame on stacked chips, comprising: a lead-frame, composed of a plurality of outer leads arranged in rows facing each other and a plurality of inner leads arranged in rows facing each other formed by a plurality of wires, wherein the plurality of inner leads are divided into first inner leads and second inner leads, and the length of the first inner leads is greater than that of the second inner leads; and a plurality of semiconductor chip devices. The active surface of each chip faces upward and chips are misaligned to form offset stacked structure, wherein the semiconductor chip device stacked uppermost is fixedly connected under said first inner leads, and the plurality of semiconductor chip devices are electrically connected to the first inner leads and the second inner leads on the same side edge.
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