| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling method in the thinning process of a wafer which can peel in a short period of time the wafer adhered with an adhesive layer and a support plate having a through-hole. SOLUTION: The method is constituted by using a wafer W adhered with an adhesive layer 1 and a support plate 2 having a through-hole 3. By sealing the through-hole 3 with a sealing material 4 in the opposite plane to the adhesive layer 1 of the support plate 2, and by heating; the air in the through-hole expands and moves into between the support plate 2 and the adhesive layer 1 reducing the adhesive force of the adhesive, and carries out the peeling. COPYRIGHT: (C)2008,JPO&INPIT |
