| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain a high inductance without causing cost increase. <P>SOLUTION: An inductor element 40 is formed on a semiconductor substrate 10. Magnetic resin bodies 30 and 66 formed of a resin material into which powder magnetic substance is distributed and covering the inductor element 40 are provided. A nonmagnetic resin layer 42 is formed of a material of low permeability to fill the clearance between wires of a winding 41. A resin agent 42 is formed of resin to which the magnetic substance is not added out of materials forming the magnetic resin layer 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
| 申请公布号 |
JP2008034507(A) |
申请公布日期 |
2008.02.14 |
| 申请号 |
JP20060204348 |
申请日期 |
2006.07.27 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
KOBAYASHI TOMONAGA;TAKITA YUZO;HASHIMOTO NOBUAKI |
| 分类号 |
H01L21/822;H01F17/00;H01L21/3205;H01L23/52;H01L27/04 |
主分类号 |
H01L21/822 |
| 代理机构 |
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