FILM WIRING BOARD, AND SEMICONDUCTOR CHIP PACKAGE AND FLAT PANEL DISPLAY UNIT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce EMI generated by a semiconductor chip for display panel drive. SOLUTION: This film wiring board consists of insulating material and is equipped with a flexible base film with a mounting surface where the semiconductor chip is mounted, a signal line with an end portion formed on the base film and connected with the semiconductor chip, a power supply line 262 extending in a line pattern of predetermined shape having multiple folding portions on the base film, and a ground line 264 extending in parallel with the power supply line on the base film. COPYRIGHT: (C)2008,JPO&INPIT