发明名称 |
SURFACE PROCESSING APPARATUS |
摘要 |
A surface processing apparatus is provided for use in the surface processing of a substrate. The surface processing apparatus comprises a plasma source and processing chamber in which a substrate is mounted in use. The processing chamber is operatively connected to the plasma source and the surface processing apparatus is characterised by a transmission plate for the transmission of plasma in use between the plasma source and processing chamber. The transmission plate comprises one or more apertures wherein the physical form of the one or more apertures and/or the distribution of the one or more apertures is adapted to provide a predetermined processing pattern upon the surface of the substrate. Typically the design of the apertures is adapted to provide a substantially uniform deposition rate across a wafer substrate.
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申请公布号 |
US2008035608(A1) |
申请公布日期 |
2008.02.14 |
申请号 |
US20070835618 |
申请日期 |
2007.08.08 |
申请人 |
THOMAS OWAIN P;GRIFFITHS ANDREW J V;COOKE MICHAEL J |
发明人 |
THOMAS OWAIN P.;GRIFFITHS ANDREW J.V.;COOKE MICHAEL J. |
分类号 |
H01L21/306;C23C16/00;H05H1/24 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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