SUBSTRATE AND PROCESS FOR SEMICONDUCTOR FLIP CHIP PACKAGE

摘要

A semiconductor package structure for flip chip package includes substrate (830) and chip (820). The substrate (830) comprises at least a patterned circuit layer (860) and an insulating layer (832). The patterned circuit layer includes a plurality of bump pads (840), the insulating layer includes a plurality of etching holes (834). Bumps (810) are disposed on the active surface of the chip, which can be obtained by stud bumping. The etching holes are filled with solder paste (870), and the bumps of the chips penetrate into the solder filled etching holes.