| 摘要 |
A resin composition for a copper clad laminate is provided to allow a direct union with a polyimide metal laminate even without a roughening treatment and have excellent peel strength between a polyimide layer and a metal layer. A resin composition for a copper clad laminate includes (a) 1-90wt% of a silane coupling agent having a structure represented by the formula of (R1O)3Si-R2-X, and (b) 10-80wt% of a metal alkoxide having a structure represented by the formula of Ma(OR3)b. In the formulae, R1 and R3 are a hydrogen atom or an alkyl group having at most 10 carbon atoms, R2 is a linker and is an alkyl group having at most 10 carbon atoms, X is any one selected from dioxoranylalkyl, dioxanylalkyl, ketal, acetal, diacetal, alkylideneacetal, phenyl alkylideneacetal, benzylideneacetal, and cycloacetal groups, M is a metal, and a and b are the numbers of 4 or smaller. |
