发明名称 ELECTROSTATIC CHUCK DEVICE
摘要 <p>Disclosed is an electrostatic chuck device which enables to perform a plasma process having high in-plane uniformity to a plate-like sample by improving the in-plane uniformity of the electric field intensity in a plasma when applied to a plasma processing apparatus. Specifically disclosed is an electrostatic chuck device (21) comprising an electrostatic chuck portion (22), a metal base portion (23) serving as a high-frequency generating electrode, and an insulating plate (24). The electrostatic chuck portion (22) is composed of a dielectric plate (31) whose upper surface (31a) serves as a mounting surface on which a plate-like sample (W) is placed, a supporting plate (32), an internal electrode (25) for electrostatic suction, and an insulating material layer (33). The internal electrode (25) for electrostatic suction is made of a composite sintered body containing an insulating ceramic and silicon carbide, while having a volume resistivity of not less than 1.0 x 10<SUP>-1</SUP> O cm but not more than 1.0 x 10<SUP>5</SUP> O cm.</p>
申请公布号 WO2008018341(A1) 申请公布日期 2008.02.14
申请号 WO2007JP65073 申请日期 2007.08.01
申请人 SUMITOMO OSAKA CEMENT CO., LTD.;INAZUMACHI, HIROSHI;KOSAKAI, MAMORU;MIURA, YUKIO;MAKI, KEIGO 发明人 INAZUMACHI, HIROSHI;KOSAKAI, MAMORU;MIURA, YUKIO;MAKI, KEIGO
分类号 H01L21/683;H01L21/205;H01L21/3065;H02N13/00 主分类号 H01L21/683
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