| 摘要 |
A method for horizontally electroplating, electro-depositing or electroless-plating a thin film on a substrate that is aligned almost horizontally on a holder is provided. A method for horizontally electroplating, electro-depositing or electroless-plating a thin film on a substrate comprises: a step(10) of transferring a substrate to a substrate holder and placing the substrate horizontally on the substrate holder; a step(11) of moving a plurality of stop plates to form an enclosure on the edges of the substrate by surrounding horizontal edges of the substrate; a step(12) of moving a first electrode to contact the first electrode with a portion of the substrate that is a non-wired region; a step(13) of moving a second electrode having a polarity opposing to that of the first electrode over the substrate while the second electrode does not come in contact with the substrate; and a step(14) of filling an electroplating solution in the enclosure formed by the stop plates to contact the electroplating solution with the second electrode above the substrate, thereby perform electroplating or electro-deposition.
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