| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a load lock device capable of rapidly increasing the degree of vacuum, and a substrate processing apparatus and a substrate processing system equipped with the same. <P>SOLUTION: A load lock chamber RL is provided with a chamber 201. A vacuum pump 205 is connected to the bottom of the chamber 201 via a piping 205a. A cooling piping 208 is buried in the upper part of the chamber 201. One end and the other end of the cooling piping 208 are connected to a cooling medium circulating device 208a. When the chamber 201 is depressurized, the chamber 201 is continuously cooled during a period from a time point when the pressure of the chamber 201 becomes lower than a threshold to a time immediately before the chamber 201 is opened to the atmospheric pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
