| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which is dividable by cutting without burring a metal, and easily forms side terminals without producing the chip of the metal. SOLUTION: The substrate comprises a plurality of through-holes and trenches disposed between the through-holes. The trenches have taper faces and conductive metal layers on a part or all of the taper faces with leaving a space between the conductive metal layers formed on both taper faces at both sides of the trench. COPYRIGHT: (C)2008,JPO&INPIT
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