| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cooling device which can effectively reduce temperature unevenness on the upper surface of a cooling section. SOLUTION: The cooling section 5 in a substrate cooler 1 for cooling a semiconductor wafer 2 has a cooling block body 6, and a SUS pipe 7 arranged in the cooling block body 6, in a meandering form. The cooling block body 6 constituted of a plate layer 9 constituted of a composite material of carbon and aluminum or an aluminum alloy. COPYRIGHT: (C)2008,JPO&INPIT
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