发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor device having an SOI structure including a semiconductor substrate, a buried insulating layer and an SOI layer including, first and second element formation regions provided in said SOI layer, a partial isolation region including a partial insulating film provided in an upper layer portion of said SOI layer and a semiconductor region to be a part of said SOI layer which is provided under said partial insulating film and serving to isolate said first and second element formation regions from each other, and first and second MOS transistors formed in said first and second element formation regions, respectively, wherein at least one of a structure of a body region, a structure of a gate electrode and presence/absence of body potential fixation in said first and second MOS transistors is varied to make transistor characteristics of said first and second MOS transistors different from each other.
申请公布号 US2008035996(A1) 申请公布日期 2008.02.14
申请号 US20070830364 申请日期 2007.07.30
申请人 RENESAS TECHNOLOGY CORP. 发明人 MATSUMOTO TAKUJI;MAEDA SHIGENOBU;IWAMATSU TOSHIAKI;IPPOSHI TAKASHI
分类号 H01L27/01;H01L27/04;H01L21/336;H01L21/762;H01L21/822;H01L21/8238;H01L21/8244;H01L21/84;H01L27/08;H01L27/092;H01L27/10;H01L27/11;H01L27/12;H01L29/786 主分类号 H01L27/01
代理机构 代理人
主权项
地址